[Summer 2025] Module Equipment Engineer Intern

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona module engineering departments are looking for equipment engineering talents to join our 5-nanometer fab, located in sunny Phoenix, Arizona. As an Equipment Engineer, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.

Equipment Engineer is focusing on improving tool performance and availability while meeting uptime and cycle time requirements.

• CMP   : Chemical Mechanical Planarization (The dept. responsible for removing excess materials from wafers to create a smooth surface)
• CVD   : Chemical Vapor Deposition (The dept. responsible for producing high-quality, and high-performance solid materials through gases reacting to form film deposits on substrate)
• PVD   : Physical Vapor Deposition (The dept. responsible for vaporizing solid material in a vacuum and depositing vaporized materials onto a surface of a part)
• EPI     : Epitaxy (The dept. responsible for growing or depositing monocrystalline films on a structure or surface)
• DIF     : Diffusion (The dept. responsible for forming the source, drain and channel regions in a MOS transistor)
• WET   : Wet Clean (The dept. responsible for removing residual particles and other contamination on wafer surfaces)
• ME     : Metrology (The dept. responsible for measuring the semiconductor wafer for accuracy)
• Etch   : Dry Etch and Wet Etch (The dept. responsible for removing layers or slices of a material via different methods)
• LIT     : Lithography (The dept. responsible for drawing highly complex circuit patterns via ultra-high performance lenses onto the wafer)

Job Description:

Your main responsibilities include, but are not limited to:

• Maintain equipment performance in clean room environment for quality production.
• Handling on-duty and fundamental alarm troubleshooting.
• Installing/qualifying new tool sets according to planned schedule in a timely manner.
• Finding root cause and solving critical equipment issues.
• Improving tool uptime availability and driving defect reduction.
• Identifying and pursuing opportunities for hardware capability enhancement.
• Building defense/monitoring system to prevent equipment failure or performance lost.
• Managing vendor relationships and being responsible for module liaison with facilities, vendor, and manufacturing shift personnel.

Qualifications:

Applicants must be legally eligible to work in the United States and:

• Must be currently enrolled in a Bachelor's/Master's degree program in Electronics, Electrical Engineering, Mechanical Engineering, Mechanics, Mechatronics Engineering, or equivalent fields.
• Must be able to work full-time (40 hours per week) on-site at our Phoenix location, from
  • Semester system: May 19, 2025 – August 1, 2025.
  • Quarterly system: June 16, 2025 -- August 30, 2025
• Academic skills of numerical analysis, statistics, optics, chemistry, or physics.
• Able to lift weight consistent with applicable regulations and/or safety guidelines, including NIOSH lifting recommendations.
• Able to work in a cleanroom environment, gowning up in coveralls, hoods, boots, safety glasses and gloves. Spend significant amount of time on the factory floor working on the tools.

Personal Attributes:

• Good communication and interpersonal skills that enable you to work on cross-functional and geographically dispersed teams.
• Able to take initiatives, adapt priorities and responsibilities to support business needs.
• Hands-on participant with a strong sense of ownership.
• A team player that can multitask and thrive in a very dynamic and fast-paced environment.
• Goal driven with demonstrated ability of working in a high performing team culture.
• Quick assimilation to new technology.
• Ability to troubleshoot complex problems and to own the efforts to address and resolve root causes.